GAS PIPING METHOD

PURPOSE:To enable the gas system on a semiconductor manufacturing device side to be purged efficiently and safely within a short time by a method wherein a valve box having the gas system composed of a nitrogen purge line, a vacuum purge line and a semiconductor gas feed line is arranged close to th...

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Bibliographische Detailangaben
1. Verfasser: SAKAI KATSUO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To enable the gas system on a semiconductor manufacturing device side to be purged efficiently and safely within a short time by a method wherein a valve box having the gas system composed of a nitrogen purge line, a vacuum purge line and a semiconductor gas feed line is arranged close to the semiconductor manufacturing device. CONSTITUTION:A valve box 2 and a gas piping 5 feed semiconductor gas to a semiconductor manufacturing device 1 and a cylinder cabinet 3 while the valve box 2 is arranged close to the semiconductor manufacturing device 1. On the other hand, the gas system parts and the pipings i.e., semiconductor gas feed lines 6, 7, a nitrogen purge line 8, a vacuum purge line 9, diaphragm valves 10, 10a-10g, a check valve 11 and a pressure gauge 12 are contained in the valve box 2.