PLATING METHOD OF ACTIVE METAL FILM

PURPOSE:To allow the plating of an active metal with secure adhesion of a film by installing the active metal as a positive electrode and a work electrode as a negative electrode into an electrolytic plating bath and irradiating the surfaces of the respective metals with lasers of the wavelengths most liable to be absorbed. CONSTITUTION:The active metal 2 connected to the positive electrode of a DC power source 4 and the work metal 3 connected to the negative electrode are inserted into the plating bath contg. an active metal ion M. The respective metals 2, 3 are irradiated with the laser beams 7, 8 of the specific wavelengths liable to be absorbed from laser beam sources 5, 6 while the beams are scanned in X, Y directions. The oxide film of the active metal 2 breaks and the active metal is liable to be made into the activated ion M. A thermally decomposed part arises on the work metal 3 side and the potential difference from the active metal ion M approaching the surface of the work metal 3 precipitates the active metal M by the chemical reaction M+e M, thereby forming a plating layer.