PREPREG AND MULTI-LAYER CIRCUIT BOARD

PURPOSE:To obtain the subject prepreg for electronic equipment, etc., sufficiently workable at low temperature under low pressure in bonding and capable of shortening the working time by successively applying a tetrafluoroethylene- hexafluoropropylene copolymer layer, etc., on a cloth substrate. CON...

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Bibliographische Detailangaben
Hauptverfasser:	IWASAKI NAOTO, MOTOGAMI MITSURU, SHIBAGAKI KAZUYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain the subject prepreg for electronic equipment, etc., sufficiently workable at low temperature under low pressure in bonding and capable of shortening the working time by successively applying a tetrafluoroethylene- hexafluoropropylene copolymer layer, etc., on a cloth substrate. CONSTITUTION:The objective prepreg 7 is produced by forming a layer 2 of a tetrafluoroethylene-hexafluoropropylene copolymer (abbreviated to FEP) or a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer on a cloth substrate 1 and applying a polytetrafluoroethylene layer 3 and an FEP layer 4 on the copolymer layer 2.