LEAD FRAME FOR RESIN-SEALED SEMICONDUCTOR DEVICE

LEAD FRAME FOR RESIN-SEALED SEMICONDUCTOR DEVICE

PURPOSE:To eliminate such a problem as edge touch, wire flow, etc., at the time of assembly by cutting off at least one corner section of an island. CONSTITUTION:Since one corner section of an island is obliquely cut off, an IC chip 1 protrudes front the island 2 this corner section. When one corner...

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1. Verfasser: KOSHIMARU SHIGERU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator KOSHIMARU SHIGERU
description PURPOSE:To eliminate such a problem as edge touch, wire flow, etc., at the time of assembly by cutting off at least one corner section of an island. CONSTITUTION:Since one corner section of an island is obliquely cut off, an IC chip 1 protrudes front the island 2 this corner section. When one corner section of the island 2 is cut off in such way, a lead 3 which cannot be made to detour leftward under the restriction of the conventional standard size can be extended to the side of another lead 4 and a wire 6 can electrically be connected to a bonding pad 5B without causing such a trouble as edge touch, wire flow, etc., in the course of the assembling process. Therefore, the trouble caused by the positional relation between a bonding pad and a lead at the time of assembly can be remedied remarkably and a large degree of freedom can be obtained in the layout design.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH04165660A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH04165660A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH04165660A3</originalsourceid><addsrcrecordid>eNrjZDDwcXV0UXALcvR1VXDzD1IIcg329NMNdnX0cXVRCHb19XT293MJdQ4BSrm4hnk6u_IwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NTigsTk1LzUknivAA8DE0MzUzMzA0djYtQAABSfJkQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LEAD FRAME FOR RESIN-SEALED SEMICONDUCTOR DEVICE</title><source>esp@cenet</source><creator>KOSHIMARU SHIGERU</creator><creatorcontrib>KOSHIMARU SHIGERU</creatorcontrib><description>PURPOSE:To eliminate such a problem as edge touch, wire flow, etc., at the time of assembly by cutting off at least one corner section of an island. CONSTITUTION:Since one corner section of an island is obliquely cut off, an IC chip 1 protrudes front the island 2 this corner section. When one corner section of the island 2 is cut off in such way, a lead 3 which cannot be made to detour leftward under the restriction of the conventional standard size can be extended to the side of another lead 4 and a wire 6 can electrically be connected to a bonding pad 5B without causing such a trouble as edge touch, wire flow, etc., in the course of the assembling process. Therefore, the trouble caused by the positional relation between a bonding pad and a lead at the time of assembly can be remedied remarkably and a large degree of freedom can be obtained in the layout design.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>1992</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19920611&amp;DB=EPODOC&amp;CC=JP&amp;NR=H04165660A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19920611&amp;DB=EPODOC&amp;CC=JP&amp;NR=H04165660A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KOSHIMARU SHIGERU</creatorcontrib><title>LEAD FRAME FOR RESIN-SEALED SEMICONDUCTOR DEVICE</title><description>PURPOSE:To eliminate such a problem as edge touch, wire flow, etc., at the time of assembly by cutting off at least one corner section of an island. CONSTITUTION:Since one corner section of an island is obliquely cut off, an IC chip 1 protrudes front the island 2 this corner section. When one corner section of the island 2 is cut off in such way, a lead 3 which cannot be made to detour leftward under the restriction of the conventional standard size can be extended to the side of another lead 4 and a wire 6 can electrically be connected to a bonding pad 5B without causing such a trouble as edge touch, wire flow, etc., in the course of the assembling process. Therefore, the trouble caused by the positional relation between a bonding pad and a lead at the time of assembly can be remedied remarkably and a large degree of freedom can be obtained in the layout design.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1992</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDwcXV0UXALcvR1VXDzD1IIcg329NMNdnX0cXVRCHb19XT293MJdQ4BSrm4hnk6u_IwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NTigsTk1LzUknivAA8DE0MzUzMzA0djYtQAABSfJkQ</recordid><startdate>19920611</startdate><enddate>19920611</enddate><creator>KOSHIMARU SHIGERU</creator><scope>EVB</scope></search><sort><creationdate>19920611</creationdate><title>LEAD FRAME FOR RESIN-SEALED SEMICONDUCTOR DEVICE</title><author>KOSHIMARU SHIGERU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH04165660A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1992</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KOSHIMARU SHIGERU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KOSHIMARU SHIGERU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LEAD FRAME FOR RESIN-SEALED SEMICONDUCTOR DEVICE</title><date>1992-06-11</date><risdate>1992</risdate><abstract>PURPOSE:To eliminate such a problem as edge touch, wire flow, etc., at the time of assembly by cutting off at least one corner section of an island. CONSTITUTION:Since one corner section of an island is obliquely cut off, an IC chip 1 protrudes front the island 2 this corner section. When one corner section of the island 2 is cut off in such way, a lead 3 which cannot be made to detour leftward under the restriction of the conventional standard size can be extended to the side of another lead 4 and a wire 6 can electrically be connected to a bonding pad 5B without causing such a trouble as edge touch, wire flow, etc., in the course of the assembling process. Therefore, the trouble caused by the positional relation between a bonding pad and a lead at the time of assembly can be remedied remarkably and a large degree of freedom can be obtained in the layout design.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title LEAD FRAME FOR RESIN-SEALED SEMICONDUCTOR DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-30T08%3A00%3A36IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KOSHIMARU%20SHIGERU&rft.date=1992-06-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH04165660A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true