LEAD FRAME FOR RESIN-SEALED SEMICONDUCTOR DEVICE

PURPOSE:To eliminate such a problem as edge touch, wire flow, etc., at the time of assembly by cutting off at least one corner section of an island. CONSTITUTION:Since one corner section of an island is obliquely cut off, an IC chip 1 protrudes front the island 2 this corner section. When one corner section of the island 2 is cut off in such way, a lead 3 which cannot be made to detour leftward under the restriction of the conventional standard size can be extended to the side of another lead 4 and a wire 6 can electrically be connected to a bonding pad 5B without causing such a trouble as edge touch, wire flow, etc., in the course of the assembling process. Therefore, the trouble caused by the positional relation between a bonding pad and a lead at the time of assembly can be remedied remarkably and a large degree of freedom can be obtained in the layout design.