SOLDER CLAD MATERIAL AND METHOD AND APPARATUS FOR PRODUCING THE MATERIAL

PURPOSE:To facilitate the execution of soldering without generating bridging and unsoldering by sticking a specific amt. of copper by a wet process plating method on one surface of solder foil which consists of specific weight % of tin or indium and has a specific thickness. CONSTITUTION:The clad ma...

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Bibliographische Detailangaben
Hauptverfasser:	HASEGAWA NAGAYOSHI, KATO RIKIYA, NAKAMURA KISAKU, TANIGUCHI SANAE
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SOLDERING OR UNSOLDERING SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PURPOSE:To facilitate the execution of soldering without generating bridging and unsoldering by sticking a specific amt. of copper by a wet process plating method on one surface of solder foil which consists of specific weight % of tin or indium and has a specific thickness. CONSTITUTION:The clad material is constituted by sticking 20 to 100mum copper by the wet process plating method to one surface of the solder foil which consists of >=0.5wt.% tin and >=5wt.% indium and has 20 to 100mum thickness. A mask material is applied by a mask material applying device 2 on one surface of the traveling solder foil 9. An electroless plating liquid 12 of copper having 6 to 8 pH is put into a plating cell 3. The solder foil 9 is rinsed with a primary rinsing device 4. An electrolytic plating liquid 15 and a plate 16 are put into an electrolytic plating cell 5. The solder foil stuck with the electrolytic plating liquid is rinsed with a secondary rinsing device 7. The band-shaped solder foil is continuously and stably plated with the copper in this way.