ELECTRODEPOSITION TYPE UV RESIST FORMING METHOD AND DEVICE

PURPOSE:To enable an electrodeposition type UV resist to be formed through a horizontal transfer by a method wherein a roller loaded with electrodeposition solution is brought into contact with a printed wiring board, and a voltage is applied between the printed wiring board and a roller shaft. CONSTITUTION:When a printed wiring board 1 is made to pass through between rollers 3 and 3' loaded with electrodeposition solution, a voltage is applied between guide rollers 5 and 5' and roller shafts 2 and 2'. At this point, as the guide rollers 5 and 5' are in contact with a resist unattached part 1' of a printed wiring board 1, in result a voltage is applied between the roller shafts 2 and 2' and both the front and the rear of the printed wiring board 1 covered with a copper foil. The rollers 3 and 3' loaded with electrodeposition solution are brought into contact with the front and the rear copper foil of the printed wiring board 1 rotating on the roller shafts 2 and 2', whereby an electrodeposition type UV resist 7 is formed on the front and the rear copper foil of the printed wiring board 1 where a current is made to flow through the electrodeposition solution concerned.