HYBRID IC AND CERAMIC CAP FOR SEALING SEMICONDUCTOR

PURPOSE:To prevent an obstacle due to electromagnetic waves and electric noise, by forming an electromagnetic shield layer on the inner surface and/or the outer surface of a ceramic cap. CONSTITUTION:An electromagnetic shield layer 2 is formed on the inner surface and/or the outer surface of a ceram...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	OKISHIMA TETSUYA, YAMANAKA HISAYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:To prevent an obstacle due to electromagnetic waves and electric noise, by forming an electromagnetic shield layer on the inner surface and/or the outer surface of a ceramic cap. CONSTITUTION:An electromagnetic shield layer 2 is formed on the inner surface and/or the outer surface of a ceramic cap 1. A metal layer like copper, tungsten, silver, silver-palladium, molybdenum, etc., is formed as the electromagnetic shield layer 2. Plating method, printing method, brush-spreading method, etc., can be used for forming the layer. Thereby the permeation of electromagnetic waves and electric noise from the outside can be blocked, the influence of electromagnetic waves and electric noise upon a bare chip IC is reduced, and malfunction and damage can be prevented.