LEAD TERMINAL STRUCTURE FOR ELECTRONIC COMPONENT

PURPOSE:To alleviate a thermal stress due to the difference of linear expansion coefficient and to reduce a fatigue damage of a soldered part of lead terminal of an electronic component by so disposing the lead terminal of the component as to protrude obliquely to the side of the component. CONSTITU...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TANI SHUICHI, SATO MITSURU, HIROTA SANEYASU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To alleviate a thermal stress due to the difference of linear expansion coefficient and to reduce a fatigue damage of a soldered part of lead terminal of an electronic component by so disposing the lead terminal of the component as to protrude obliquely to the side of the component. CONSTITUTION:Lead terminals 1 are so disposed as to protrude obliquely to the side of an electronic component, and electrode bonding parts of the ends are soldered to electrodes. Accordingly, when a force is applied to the terminal 1 by the difference of linear expansion coefficients, a semiconductor package 2 is slightly rotated in a plane by its reaction, thereby alleviating a strain to be applied to the terminal 1. That it, only a vertical force is applied to a conventional lead terminal, but a vertical force is alleviated by an oblique deformation to reduce the fatigue damage of the soldered part.