HEAT-TREATMENT DEVICE

PURPOSE:To obtain a device with which the surface uniformity will be improved in treating a substrate by a method wherein the device is provided with a plurality of supporting plates which support the substrate to be treated by engaging the circumferential part of the substrate to be treated with a plurality of substrate supporting pieces provided on one side face of a ring-shaped plate, and a supporting pole which supports the circumferential part of the supporting plate by a supporting-plate engagement protrusion. CONSTITUTION:In the heat-treatment device, in which a heat treatment is conducted by providing a substrate supporting pieces for a heat-treatment device which supports a plurality of substrates 4 to be treated, the following materials are provided. They are plurality of substrate supporting pieces 11 provided in such a manner that they are protruding from a ring-shaped plate 10 which has the diameter larger than the substrate 4 to be treated and one side face of the ring-shaped plate 10, a plurality of supporting plates 2 which support the substrate 4 to be treated in such a manner that the circumferential part of the substrate to be treated is locked by the above-mentioned substrate supporting pieces 11 and a space is provided with the ring-shaped plate 10, and support poles 3 which support the circumferential part of the supporting plate 2 by a plurality of supporting plate locking protrusions 3a which are arranged leaving a space and surrounding the supporting plate 2 and provided in such a manner that they are protruding toward inside. For example, the above-mentioned supporting plate 2 and the supporting poles 3 are constituted by quartz and the like.