PROGRAM CONTROLLED AUTOMATIC MACHINING DEVICE

PURPOSE:To automatically remove chips and dust on a reference plane and to enable automation of a whole machining process in a device for grinding machining of a large part for vehicle by sliding and fixing a workpiece on the reference plane of a skid pad. CONSTITUTION:A workpiece 2 is received by a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHIMADA TAKESHI, KOGA NORIKAZU
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To automatically remove chips and dust on a reference plane and to enable automation of a whole machining process in a device for grinding machining of a large part for vehicle by sliding and fixing a workpiece on the reference plane of a skid pad. CONSTITUTION:A workpiece 2 is received by a second slider 14 of a loader 8 and raised to the height where the lower surface of the workpiece 2 mounted on the slider 14 is leveled with the upper surface of a skid pad 7. When it has reached the lift-up end, a first slider 13 is advanced in the Y direction and stopped immediately before a cover of a machining device, and the slider 14 is also advanced and the workpiece 2 is slid on the upper surface (reference place) of the skid pad 7. The workpiece 2 is fixed by a fixing means 4 and then its model is detected by a detecting means. A program is selected by its detection output and the upper surface is machined. When the upper surface machining is finished, the slider 13 receives the workpiece 2 and returns it to the original position with the slider 14. Then, the workpiece 2 is inverted and the lower surface is machined.