ETCHING DEVICE

PURPOSE:To provide an etching device capable of removing the protective film of side walls on a wafer surface effectively and completely by preparing a preheating stage for keeping a wafer at a predetermined temperature before a wetting treatment. CONSTITUTION:In a wiring process, a wafer 8 is transported onto a centering unit 31 in a second chamber 3 of an etching device. The wafer 8 is moved from the centering unit to a preheating stage 10 by a robot arm 32. When the wafer is heated to 60 deg.C, it is moved from the stage 10 to a wet stage 14 in a wetting cup 11 by the robot arm 32. This temperature control of the wafer before the wet treatment enables the effective and complete removal of the protective film of side walls.