METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE

PURPOSE:To keep the continuity of the electric characteristic of semiconductor pellets even when an arbitrary lead frame falls off by a method wherein, when the semiconductor pellets divided from a semiconductor wafer are pellet-bonded to a lead frame, they are pellet-bonded in such a way that the e...

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Bibliographische Detailangaben

Hauptverfasser:	OGURI KEIJI, INOUE HAJIME
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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