METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE

PURPOSE:To keep the continuity of the electric characteristic of semiconductor pellets even when an arbitrary lead frame falls off by a method wherein, when the semiconductor pellets divided from a semiconductor wafer are pellet-bonded to a lead frame, they are pellet-bonded in such a way that the electric characteristic of the semiconductor pellets between both lead frames in a relationship between the front and the rear with reference to the arbitrary lead frame is continued. CONSTITUTION:Semiconductor pellets 8 divided from a semiconductor wafer 2 are taken up based on a taking-up sequence; they are pellet-bonded to prescribed positions on a lead frame 6. In this case, the semiconductor pellets 8 on the semiconductor wafer 2 are taken up in a zigzag shape at a stroke which is half the quantity of the semiconductor pellets 8 bonded inside one lead frame 6. In this manner, all the semiconductor pellets 8 on one semiconductor wafer 2 are mounted on the lead frame 6. Consequently, even when an arbitrary lead frame 6 falls off, the number of semiconductor pellets 8 which fall off on lead frames 6 of the lead frame which has falen off in the front and the rear can be reduced to only two on the semiconductor wafer 2.