SEMICONDUCTOR DEVICE
PURPOSE:To quickly radiate the heat generated by an electric pattern circuit on the semiconductor element surface by providing directly a heat sink block to a heat sink space provided at the surface of semiconductor element. CONSTITUTION:A heat sink space 11 is provided for direct mounting of a heat...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PURPOSE:To quickly radiate the heat generated by an electric pattern circuit on the semiconductor element surface by providing directly a heat sink block to a heat sink space provided at the surface of semiconductor element. CONSTITUTION:A heat sink space 11 is provided for direct mounting of a heat sink block 10 on the surface of a semiconductor element 1. This space 11 is provided directly to the heat sink block 10 which is molded in the form of an umbrella through high heat conductive bonding agent or metal brazing material 8. A material of this block 10 has a high heat conductivity and also has a heat expansion coefficient which is almost equal to that of the semiconductor element 1. Here, the umbrella part of the heat sink block 10 is exposed to the outside of sealing resin 9 which forms a semiconductor device package. The heat generated at the surface of semiconductor element 1 is transferred to the umbrella part and it is radiated into the open air from the umbrella part. |
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