OPTICAL SENSOR ELEMENT AND MANUFACTURE THEREOF

PURPOSE:To eliminate irregularities which work as an obstacle to light incident on a sensor body from the outer surface of the sensor by a method wherein optical modules which form an optical system are joined into one piece by molding resin, and a conductive path connected to the terminal of an opt...

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1. Verfasser: UMEGAKI TAKU
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To eliminate irregularities which work as an obstacle to light incident on a sensor body from the outer surface of the sensor by a method wherein optical modules which form an optical system are joined into one piece by molding resin, and a conductive path connected to the terminal of an optical sensor element is interposed at an interface between the molding resin and the optical modules. CONSTITUTION:A light emitting plane 21 of an optical module 2 of a transparent resin molded body of acrylic resin or the like is surrounded with a protrusion 3. Two stripe-like conductive paths are provided to the protrusions 3. Al is formed into the conductive path 4 through evaporation and patterning. An optical sensor chip 1 is arranged confronting the light emitting plane 21 of the optical module 2, and input- output terminals provided to the ends of the sensor chip 1 and the end of the conductive paths are electrically connected together with conductive adhesive agent 5. Transparent resin 6 is filled into the recess surrounded with the protrusion 3 not only to cover the side of the chip 1 opposite to its plane of light incidence but also to penetrate into a space between the chip 1 and the light emitting plane 21 of the optical module 2. By this setup, the optical sensor chip 1 is sealed up with molding resin and integrated into one piece with the optical module 2.