SEMICONDUCTOR DEVICE

PURPOSE:To prevent short circuits or defective image due to foreign material which is enclosed in a package by installing a spiral tunnel in the package. CONSTITUTION:In a ceramic package, a tunnel 8 which has an opening in the inner corner of a ceramic case 3 having a recessed part at its center is of a three-turn spiral. A semiconductor chip 1, being mounted with adhesive agent on a chip mounting section on the ceramic package which is formed at the bottom face of the recessed part of the ceramic case 3, is connected electrically with external leads 5 which are led out to the outside of the ceramic case 3, through metal fine lines 4 which are bonded to electrode pads of the semiconductor chip 1. After clearing foreign material away from the ceramic package, a ceramic cap 2 is fixed firmly to the upper end face of the ceramic case 3 through sealing material 6 to seal the ceramic package hermetically. Even if the ceramic package is sealed hermetically with foreign material, etc., being mixed in by mistake, a proper amount of inclination and vibration of the ceramic package moves the foreign material to the end of the tunnel 8.