SOLDERING METHOD FOR ELECTRIC CIRCUIT AND THE ELECTRONIC CIRCUIT BOARD

PURPOSE:To select the composition of solder being created according to the material to be bonded or the conditions of fusion by stacking an Sn layer and a Pb layer on the surface of an external lead junction, and bringing the junction of the lead into contact. CONSTITUTION:An external lead junction...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	HAYAKAWA TETSUHARU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:To select the composition of solder being created according to the material to be bonded or the conditions of fusion by stacking an Sn layer and a Pb layer on the surface of an external lead junction, and bringing the junction of the lead into contact. CONSTITUTION:An external lead junction part, which has a laminate of two layers of Sn and Pb at the surface of a printed board or a ceramic electronic circuit board, is heated below the resonance temperature of Sn-Pb composition alloy to be created so as to alternately diffuse Sn and Pb overlaid on the junction, and then it is heated above the resonance temperature of created Sn-Pb composition alloy and below the melting point of Pb so as to fuse the laminate into one, thus the junction are mutually joined.