ELECTRONIC PART AND ITS MANUFACTURE

PURPOSE:To lower a height of a part body during mounting by providing a processing part of an external lead-out electrode with a first bending part near the electrode and a second bending part far therefrom and by providing a coating resin part to prevent it from reaching the second bending part. CONSTITUTION:Each of lead wires 3 is provided with a processing part 3b which has a first bending part A which is bent by a specified angle theta in an inner direction of electrodes 2 facing each other and a second bending part B which is bent by a specified angle theta in parallel with the electrodes 2. The processing parts 3b are provided near the electrodes 2 of an electronic part element 1. Then, a thermosetting epoxy resin 4 is applied by dip method as coating of the electronic part and excessive resin which attaches to the lead wires is removed between the lead line bending parts A and B. It is possible to lower a height of a part body from a P-plate surface during mounting by mechanically removing attaching coating resin or excessive resin after forming of a lead wire.