MANUFACTURE OF MULTILAYER INTERCONNECTION CERAMIC BOARD

PURPOSE:To easily remove a needless part as a conductor circuit by forming a plating resist film on a needless part as the conductor circuit on an exposed surface of an inner conductor layer while forming the conductor circuit on the surface of a ceramic board and a gold-plated coating after removin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAMANAKA HIDEKI, WATABIKI TSUTOMU, YAMADA TAKAO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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