MANUFACTURE OF MULTILAYER INTERCONNECTION CERAMIC BOARD

PURPOSE:To easily remove a needless part as a conductor circuit by forming a plating resist film on a needless part as the conductor circuit on an exposed surface of an inner conductor layer while forming the conductor circuit on the surface of a ceramic board and a gold-plated coating after removing the plating resist film and performing heat treatment in the atmosphere. CONSTITUTION:A plating resist film 5 is formed on a part of an exposed part of an inner conductor layer 3 of a ceramic wiring board and inside a through- hole 4. Next, a nickel-plated layer 6 is formed on the exposed surface of the inner conductor layer 3 where no plating resist film 5 is formed. Later, a gold- plated layer 7 is formed on the upper face of the nickel-plated layer 6. Next, after removing the plating resist layer, silver-palladium paste is printed on the top surface of the gold-plated layer and the surface of the ceramic board on its periphery, and after it is dried and deprived of a solvent, it is fired in order to peel off and remove the exposed part of the inner conductor layer 3 to obtain a ceramic multilayer interconnection board.