MANUFACTURE OF MULTILAYER INTERCONNECTION CERAMIC BOARD
PURPOSE:To easily remove a needless part as a conductor circuit by forming a plating resist film on a needless part as the conductor circuit on an exposed surface of an inner conductor layer while forming the conductor circuit on the surface of a ceramic board and a gold-plated coating after removin...
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| creator | YAMANAKA HIDEKI WATABIKI TSUTOMU YAMADA TAKAO |
| description | PURPOSE:To easily remove a needless part as a conductor circuit by forming a plating resist film on a needless part as the conductor circuit on an exposed surface of an inner conductor layer while forming the conductor circuit on the surface of a ceramic board and a gold-plated coating after removing the plating resist film and performing heat treatment in the atmosphere. CONSTITUTION:A plating resist film 5 is formed on a part of an exposed part of an inner conductor layer 3 of a ceramic wiring board and inside a through- hole 4. Next, a nickel-plated layer 6 is formed on the exposed surface of the inner conductor layer 3 where no plating resist film 5 is formed. Later, a gold- plated layer 7 is formed on the upper face of the nickel-plated layer 6. Next, after removing the plating resist layer, silver-palladium paste is printed on the top surface of the gold-plated layer and the surface of the ceramic board on its periphery, and after it is dried and deprived of a solvent, it is fired in order to peel off and remove the exposed part of the inner conductor layer 3 to obtain a ceramic multilayer interconnection board. |
| format | Patent |
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CONSTITUTION:A plating resist film 5 is formed on a part of an exposed part of an inner conductor layer 3 of a ceramic wiring board and inside a through- hole 4. Next, a nickel-plated layer 6 is formed on the exposed surface of the inner conductor layer 3 where no plating resist film 5 is formed. Later, a gold- plated layer 7 is formed on the upper face of the nickel-plated layer 6. Next, after removing the plating resist layer, silver-palladium paste is printed on the top surface of the gold-plated layer and the surface of the ceramic board on its periphery, and after it is dried and deprived of a solvent, it is fired in order to peel off and remove the exposed part of the inner conductor layer 3 to obtain a ceramic multilayer interconnection board.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>1991</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19910410&DB=EPODOC&CC=JP&NR=H0385795A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19910410&DB=EPODOC&CC=JP&NR=H0385795A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAMANAKA HIDEKI</creatorcontrib><creatorcontrib>WATABIKI TSUTOMU</creatorcontrib><creatorcontrib>YAMADA TAKAO</creatorcontrib><title>MANUFACTURE OF MULTILAYER INTERCONNECTION CERAMIC BOARD</title><description>PURPOSE:To easily remove a needless part as a conductor circuit by forming a plating resist film on a needless part as the conductor circuit on an exposed surface of an inner conductor layer while forming the conductor circuit on the surface of a ceramic board and a gold-plated coating after removing the plating resist film and performing heat treatment in the atmosphere. CONSTITUTION:A plating resist film 5 is formed on a part of an exposed part of an inner conductor layer 3 of a ceramic wiring board and inside a through- hole 4. Next, a nickel-plated layer 6 is formed on the exposed surface of the inner conductor layer 3 where no plating resist film 5 is formed. Later, a gold- plated layer 7 is formed on the upper face of the nickel-plated layer 6. Next, after removing the plating resist layer, silver-palladium paste is printed on the top surface of the gold-plated layer and the surface of the ceramic board on its periphery, and after it is dried and deprived of a solvent, it is fired in order to peel off and remove the exposed part of the inner conductor layer 3 to obtain a ceramic multilayer interconnection board.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1991</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD3dfQLdXN0DgkNclXwd1PwDfUJ8fRxjHQNUvD0C3ENcvb383N1DvH091Nwdg1y9PV0VnDydwxy4WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8V4BHgbGFqbmlqaOxkQoAQATKyhO</recordid><startdate>19910410</startdate><enddate>19910410</enddate><creator>YAMANAKA HIDEKI</creator><creator>WATABIKI TSUTOMU</creator><creator>YAMADA TAKAO</creator><scope>EVB</scope></search><sort><creationdate>19910410</creationdate><title>MANUFACTURE OF MULTILAYER INTERCONNECTION CERAMIC BOARD</title><author>YAMANAKA HIDEKI ; WATABIKI TSUTOMU ; YAMADA TAKAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH0385795A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1991</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>YAMANAKA HIDEKI</creatorcontrib><creatorcontrib>WATABIKI TSUTOMU</creatorcontrib><creatorcontrib>YAMADA TAKAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAMANAKA HIDEKI</au><au>WATABIKI TSUTOMU</au><au>YAMADA TAKAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MANUFACTURE OF MULTILAYER INTERCONNECTION CERAMIC BOARD</title><date>1991-04-10</date><risdate>1991</risdate><abstract>PURPOSE:To easily remove a needless part as a conductor circuit by forming a plating resist film on a needless part as the conductor circuit on an exposed surface of an inner conductor layer while forming the conductor circuit on the surface of a ceramic board and a gold-plated coating after removing the plating resist film and performing heat treatment in the atmosphere. CONSTITUTION:A plating resist film 5 is formed on a part of an exposed part of an inner conductor layer 3 of a ceramic wiring board and inside a through- hole 4. Next, a nickel-plated layer 6 is formed on the exposed surface of the inner conductor layer 3 where no plating resist film 5 is formed. Later, a gold- plated layer 7 is formed on the upper face of the nickel-plated layer 6. Next, after removing the plating resist layer, silver-palladium paste is printed on the top surface of the gold-plated layer and the surface of the ceramic board on its periphery, and after it is dried and deprived of a solvent, it is fired in order to peel off and remove the exposed part of the inner conductor layer 3 to obtain a ceramic multilayer interconnection board.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | MANUFACTURE OF MULTILAYER INTERCONNECTION CERAMIC BOARD |
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