METHOD OF POSITIONING COMPONENT TO BE MOUNTED

PURPOSE:To accurately position parts by forming isolated layers of hard magnetic material magnetized on a substrate, and forming a magnetized layer of hard magnetic material on at least the rear face of each component, so that the isolated layers and components can attract each other by magnetic force. CONSTITUTION:A magnetic ink coating 2 is formed and hardened on a printed- circuit board 1, and the coating is worked by a xenon laser to form isolated magnetic layers 3. The magnetic layers are lapped for improved surface smoothness and magnetized by a permanent magnet. On the other hand, semiconductors chips 5 are coated with ink containing a hard magnetic material on the rear or both sides. The ink is hardened at room temperature and magnetized with the polarity to attract the isolated ink layers 3. Tie printed-circuit board 1 and an elongated expander film 7 are joined closely in a manner that the isolated ink layers 3 are substantially aligned with the rear surfaces of the chip components 5. The expander film 7 is removed from the chips 5, and then the chips are mounted on the ink layers 3 by the magnetic attraction.