ELECTRIC BONDING OF METAL SI-CONTAINING SILICON CARBIDE CERAMIC

PURPOSE:To shorten bonding time and to reduce power consumption in bonding the title ceramic members mutually or the member to a metallic member by previously removing metallic Si from the butting surfaces of the ceramic members and making the surfaces porous. CONSTITUTION:In bonding square pillar Si metal-containing silicon carbide ceramic members 1a and 1b, metal Si is removed from the butting surfaces of both the members by a hydrofluoric acid-based etching solution and the surfaces are made porous. Consequently, the surfaces are subjected to a surface treatment so as to form about 1-2mm modification layers 3a and 3b to be made into high resistance. Then the surfaces of both the members to be treated are coated with a pasty electroconductive binder 4 comprising Si, SiC, C and a binder, both the members are butted and fixed by applying given pressure. Then, when an electric current is sent to both the members in an Ar gas atmosphere, since resistivity of the modification layers 3a and 3b is larger than that of other parts, the part is concentrically heated by joule heat to a high temperature and the binder 4 is melted to complete bonding.