SEMICONDUCTOR ELEMENT

PURPOSE:To obtain an accurate measurement in a wafer test by providing a section where each electrode is bonded with a wire or a film and a section which puts a probe needle in contact during a wafer test as well. CONSTITUTION:A section 11 where each electrode pad is bonded with a wire or a film is...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ORITO SHIGERU, OGURA MAKOTO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!