SEMICONDUCTOR ELEMENT

PURPOSE:To obtain an accurate measurement in a wafer test by providing a section where each electrode is bonded with a wire or a film and a section which puts a probe needle in contact during a wafer test as well. CONSTITUTION:A section 11 where each electrode pad is bonded with a wire or a film is provided and a section 12, which is connected with the section 11 in one piece and puts a probe needle into contact during wafer testing capable of separating the section from a pattern and recognizing, is also provided. Therefore, this construction makes it possible to distinguish the section 11, which bonds the wire and film from the section 12, which places the probe needle into contact during wafer testing so that they can be separately recognized. During the wafer testing, only one party of the electrode pad 1a is used so that the Al surface of the section 11 which bonds the wire or film lead may be immune to damage. This construction prevents the generation of peeling off between the electrode pad 1a and the wire or film lead after bonding.