RESIN TABLET AND MANUFACTURE OF RESIN-SEALED SEMICONDUCTOR DEVICE USING SAME

PURPOSE:To reduce the ratio of a cavity filling resin consisting of a material to be filling-formed at the cavity as compared with an entire resin tablet by providing a protruding part to be inserted into a recessed part and a pressure- feed auxiliary part consisting of a material which is different...

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1. Verfasser: KITASAKO HIROYUKI
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To reduce the ratio of a cavity filling resin consisting of a material to be filling-formed at the cavity as compared with an entire resin tablet by providing a protruding part to be inserted into a recessed part and a pressure- feed auxiliary part consisting of a material which is different from the cavity filling resin part. CONSTITUTION:A cavity filling resin part 1 has an improved resistance against moisture, is an expensive resin such as epoxy resin with less sodium or chloride, and a recessed part 21 is formed. A pressure-feed auxiliary part 2 is, for example, an inexpensive low-class resin, and a projecting part 22 to be inserted into the recessed part 21 is formed. Thus, the recessed part 21 where the central resin is reduced is formed at the cavity filling resin part 1 whose residual amount should be reduced and the protruding part 22 to be inserted into the protruding part 21 is provided at the pressure-feed auxiliary part 2, thus reducing the ratio of the cavity filling resin consisting of a material which is filled and formed at the cavity as compared with an entire resin tablet.