METHOD OF PACKAGING CAPACITOR

METHOD OF PACKAGING CAPACITOR

PURPOSE:To reduce size of a chip film capacitor and reduce the running cost of products by a method wherein ultraviolet curing resin is added and hardened on a cut face of a laminated metallized film capacitor element to make an outer package. CONSTITUTION:Ultraviolet curing resin is attached to a c...

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Hauptverfasser: SAEKI CHIHIRO, SUZAWA SHINICHI, ITOI SHINSUKE
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
ELECTRICITY
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creator SAEKI CHIHIRO
SUZAWA SHINICHI
ITOI SHINSUKE
description PURPOSE:To reduce size of a chip film capacitor and reduce the running cost of products by a method wherein ultraviolet curing resin is added and hardened on a cut face of a laminated metallized film capacitor element to make an outer package. CONSTITUTION:Ultraviolet curing resin is attached to a cut face 2 of a laminated film capacitor element 1 by specific thickness so that the ultraviolet curing resin 4 added to the laminated film capacitor element 1 is soaked in solution. The ultraviolet curing resin 4 is hardened by radiating ultraviolet rays to it so that a laminated film capacitor having an ultraviolet curing resin outer package 7 on the cut face 2 is formed. In this case, the thickness of the outer package is 0.001 to 0.15mm thereby largely reducing the size of a product. In addition production process is possible only with short hardening process. Thus running cost is reduced enabling reduction in product cost easily.
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subjects BASIC ELECTRIC ELEMENTS
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
ELECTRICITY
title METHOD OF PACKAGING CAPACITOR
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