METHOD OF PACKAGING CAPACITOR

PURPOSE:To reduce size of a chip film capacitor and reduce the running cost of products by a method wherein ultraviolet curing resin is added and hardened on a cut face of a laminated metallized film capacitor element to make an outer package. CONSTITUTION:Ultraviolet curing resin is attached to a cut face 2 of a laminated film capacitor element 1 by specific thickness so that the ultraviolet curing resin 4 added to the laminated film capacitor element 1 is soaked in solution. The ultraviolet curing resin 4 is hardened by radiating ultraviolet rays to it so that a laminated film capacitor having an ultraviolet curing resin outer package 7 on the cut face 2 is formed. In this case, the thickness of the outer package is 0.001 to 0.15mm thereby largely reducing the size of a product. In addition production process is possible only with short hardening process. Thus running cost is reduced enabling reduction in product cost easily.