MANUFACTURE OF EDGE CUT JUNCTION OF CABLE

PURPOSE:To eliminate risk of exfoliation of an external semiconductive layer or an edge cut insulation layer itself, nullify fear of generation of voids at the fusion bonding interface, and allow exertion of excellent electric characteristics by winding an unbridged rubber/plastic tape and a partial...

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Bibliographische Detailangaben
Hauptverfasser: KAZAHARU TOYOHIKO, FUJIWARA YASUTAKA, HIGURE KEIICHI
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To eliminate risk of exfoliation of an external semiconductive layer or an edge cut insulation layer itself, nullify fear of generation of voids at the fusion bonding interface, and allow exertion of excellent electric characteristics by winding an unbridged rubber/plastic tape and a partially bridged rubber/plastic tape in such a way as alternately and that the over and under are the unbridged ones, and performing fusion bonding into a single body through heating. CONSTITUTION:In the extent from No.1 external semiconductive layer 12a onto the tapered surface T of an insulative reinforcement 11, an unbridged polyethylene tape 13a and a bridged polyethylene tape 13b are wound alternately into laminate, wherein as the uppermost layer the unbridged polyethylene tape with bridging agent mixed is wound to form an edge cut insulation layer 13. Thereover a thermocontracting tube made of semiconductive polyethylene is put to form No.2 external semiconductive layer 12b, followed by heating in inert gas atmosphere so that these layers are fusion bonded solidly and that unbridged layers are subjected to bridging process. This accomplishes fast bond of the edge cut insulation layer with each external semiconductive layer, and there is no risk of generation of voids at the adhesion interface nor exfoliation.