PERIPHERY PRESSING BONDING METHOD

PURPOSE:To prevent bonding material from reducing in thickness and bonding force accompanied by indirect bonding from reducing by pressurizing a material to be bonded directly from the direction vertical to the central axis of the material to be bonded to reduce or expand the diameter and generating plastic flow of metal to the bonding end of an inner or outer periphery which is nearly annular and bonding the bonding material with the material to be bonded. CONSTITUTION:The bonding material 12 is lowered by the press down of a punch 20 sliding the outer periphery with a tapered surface 18. The main pressuring force P0 is divided by the work of a tapered surface 18, the pressurizing force F to the central direction is produced, the whole bonding material 12 is reduced in diameter and plastic flow is generated. Then, the inner peripheral surface of the bonding surface 12 is pushed to the inner peripheral surface of the bonding groove 14 of the material 10 to be bonded. When the punch 20 is pressed down further, bonding by plastic flow of metal is produced at the bonding end of the inner periphery of the bonding material 12. This plastic flow takes the same direction as the direction of the pressurizing force F and part of it makes a component vertical to this pressurizing force F and toward the direction of a groove width and is bonded firmly.