JPH0366810B

PURPOSE:To insulate a conductive polymer layer at the same time as cutting, and to manufacture a large number of capacitors quickly by using laser beams in a process in which a film-forming metallic foil on which the conductive polymer layer is formed is cut in desired size. CONSTITUTION:Dielectric...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KONO MICHUKI, ISA ISAO, FUKUDA MINORU
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To insulate a conductive polymer layer at the same time as cutting, and to manufacture a large number of capacitors quickly by using laser beams in a process in which a film-forming metallic foil on which the conductive polymer layer is formed is cut in desired size. CONSTITUTION:Dielectric oxide films 2 are shaped onto an aluminum foil 3 through electrolytic oxidation, and dipped into an ammonium persulfate aqueous solution, and conductive polypyrrole layers are formed through chemical oxidation polymerization. Polypyrrole layers 1 through electrolytic oxidation polymerization are shaped onto the conductive polypyrrole layers. The whole is cut by using a CO2 laser as shown in dotted lines, thus preparing chips.