JPH0366272B

PURPOSE:To increase adhesive strength and electroconductivity of coated metallic film formed on the surface of glass fiber and to enhance shielding effect for electromagnetic wave by forming metallic films contg. Cu or Ni in three layers on the surface of glass fiber by executing electroless plating...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	OOTSUKA HARUHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRICITY GENERAL PROCESSES OF COMPOUNDING GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MINERAL OR SLAG WOOL ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To increase adhesive strength and electroconductivity of coated metallic film formed on the surface of glass fiber and to enhance shielding effect for electromagnetic wave by forming metallic films contg. Cu or Ni in three layers on the surface of glass fiber by executing electroless plating in combination with electroplating. CONSTITUTION:A coating film of Cu or Ni having 0.01-0.5mum thickness is formed on the surface of glass fiber by the electroless plating method. Then, an electroplating film of Cu having 0.01-2mum thickness is formed on said first layer. Further, an Ni plated film having 0.01-2.5mum is formed on said second layer by the electroless electroplating method. Thus, three-layered plated metallic films are formed.