IC INSERTING APPARATUS AND IC EXTRACTING APPARATUS FOR BURN-IN BOARD

PURPOSE:To certainly insert an IC in a socket even with respect to a large and heavy burn-in board having warpage by pressing the surface not loaded with the socket of the burn-in board toward the opposite side surface thereof to correct the warpage of said board. CONSTITUTION:A burn-in board 18 is loaded with a socket 16 for mounting a burn-in IC and supported on the XY moving means of an IC inserting and extracting apparatus through the positioning means 8 and warpage correcting means 9 thereof. The means 9 is raised by a raising and lowering drive source 802 and, after the positioning of the board 18, the end part loaded with the socket 16 of the board 18 is clamped by the follower pad plates 806 of the board 18 on press rolls 805 and the under surfaces of the leading end parts of press pawls 811a, 811b. By the continuous rising of the means 9, the pawls 811a, 811b are pushed down in a state pressing the board 18 by repulsive force and, at the same time, the board 18 is pressed upwardly by the means 9 to correct the warpage of the board 18.