METHOD FOR ELECTROLESS-PLATING SYNTHETIC-RESIN PRODUCT

PURPOSE:To obtain a nonreleasable metallic layer by coating the surface of a synthetic resin product with an adhesive, dipping the product degreased in a degreasing soln. in a catalyst soln. and then in a soln. of a reaction accelerator, dipping the product in an electroless plating soln., heating a...

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Bibliographische Detailangaben
Hauptverfasser:	YOSHIKAWA SHUJI, TAKAGI KANEYUKI, YAGO MASAYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain a nonreleasable metallic layer by coating the surface of a synthetic resin product with an adhesive, dipping the product degreased in a degreasing soln. in a catalyst soln. and then in a soln. of a reaction accelerator, dipping the product in an electroless plating soln., heating and then cooling the product. CONSTITUTION:The surface of a synthetic resin product is coated with an adhesive to form the thin layer of a solvent-soluble hot-melt adhesive composition. The product is dipped in a degreasing soln. and made completely wettable with water. The degreased product is dipped in a catalyst soln. to deposit the catalyst on the adhesive-coated surface. The product is dipped in a soln. of a reaction accelerator, and then dipped in an electroless plating soln. to form a plating layer. The plated product is heated to the melting temp. of the adhesive, and then cooled to fix the plating layer. Consequently, the adhesive layer is melted, and the latent adhesive function is revealed.