DIE-PAD POSITIONING METHOD IN DIE-SHEAR TEST

PURPOSE:To prevent the floating of a die pad when shearing force is measured by pushing the upper surface of the die pad, positioning both end surface of a chip on the die pad, and positioning the rear end surface of the die pad furthermore. CONSTITUTION:At first, a handle 24 is turned leftward, and...

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1. Verfasser: KAWAKAMI MICHIO
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To prevent the floating of a die pad when shearing force is measured by pushing the upper surface of the die pad, positioning both end surface of a chip on the die pad, and positioning the rear end surface of the die pad furthermore. CONSTITUTION:At first, a handle 24 is turned leftward, and guide blocks 17 and 18 are moved backward. At this time, an upper surface 25d of a stopper 25 extrudes from the upper surface of a supporting stage 16 by the maximum length. A die pad 12 which undergoes a shearing test is mounted on the center of an upper surface 16c of the supporting stage 16. An end surface 2a of the die pad 2 is brought into contact with the an end surface 25c of the stopper 25. When the handle 24 is turned rightward, the guide blocks 17 and 18 approach the center together. An upper surface 2b of the die pad 2 is pushed with inner surfaces 17A and 18a. The positions of both end surfaces 3b of the chip 2 are determined with tip part 17b and 18b.