FILM CAPACITOR AND MANUFACTURE THEREOF
PURPOSE:To improve solder wettability by inclining the cut surface of a continuing outer electrode by a specified angle in the inner direction with respect to the cut plane of a film, or reducing the width of the cut surface of the outer electrode by providing a step with respect to the cut plane, a...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PURPOSE:To improve solder wettability by inclining the cut surface of a continuing outer electrode by a specified angle in the inner direction with respect to the cut plane of a film, or reducing the width of the cut surface of the outer electrode by providing a step with respect to the cut plane, and applying solder plating on the cut surface. CONSTITUTION:A surface 2 of an outer electrode has the inclination of 20 deg. or less (a) with respect to the cut surface of a film. The interference with the blade surface of a cutting tool is avoided by the escape owing to said inclination, Thus the cut flaws of the solder plating on the surface are prevented. A step of 0.1mm or less (b) is provided at the surface 2 of the outer electrode on the side of the cut surface so that the width of the cut surface of the outer electrode becomes small with respect to the cut surface of the film. The interference with the blade surface of the cutting toll which will be described later is avoided by the escape owing to the step. Thus, the cut flaws of the solder plating on the surface is prevented. |
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