SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

PURPOSE:To increase heat dissipating capability by employing a structure wherein thermal conductors are inserted between a plurality of semiconductor pellets, with a part thereof projecting from a semiconductor integrated circuit device. CONSTITUTION:A plurality of heat dissipating segments 5, 6 composed of thermal conductor are inserted into each gap between a plurality of semiconductor pellets 3a, 3b, 3c which are encapsulated in parallel in an enclosure 2 with predetermined interval. A part of each of the segments 5, 6 projects from the enclosure 2 and forms heat dissipating ends 5a, 6a exposed to the outer atmosphere. Heat to be produced when the plurality of semiconductor pellets 3a, 3b, 3c constituting a semiconductor device 1 operate, transfers to the plurality of heat dissipating segments 5, 6 inserted into each gap between the semiconductor pellets 3a, 3b, 3c, and is effectively radiated to the outer atmosphere, via the heat dissipating ends 5a, 6a, of the heat dissipating segments 5, 6, projecting from the enclosure 2, resulting in the improvement of heat dissipating capability.