PRODUCTION OF CERAMIC WIRING BOARD

PURPOSE:To produce the ceramic wiring board which has a good adhesive strength and is crack-free by forming a metallic film by electroless plating on the surface of the ceramics subjected to surface roughening with HF and NaOH/KOH melt and then etching the film via a resist film. CONSTITUTION:The ceramics is immersed into a soln. mixture contg. NH4F, (NH4)2SO4, H2SO4 and H2O and is then rinsed. The ceramic surface is lightly roughened by the HF generated in this way. This ceramics is then immersed into a melt mixture composed of NaOH and KOH and is neutralized and rinsed. The ceramic surface is uniformly roughened by this immersion treatment. The metallic film consisting of copper, etc., is thereafter formed by an electroless plating method on the roughened ceramic surface. A resist film is formed a top surface of the metallic film and is subjected to exposing, developing and etching, following to which the resist film is removed away and conductor wirings are formed. The ceramics wiring board which has a good adhesive property to the ceramic is obtd. in this way without generating the crack in the ceramics.