IC PACKAGE

PURPOSE:To make short a wiring pattern on a printed wiring board, to make possible a reduction in the propagation delay time of a signal, to reduce the propagation delay time of the signal due to a wiring in an IC package and further, to obtain the IC package capable of reducing AC noise, by a method wherein the package is formed into a hexagon. CONSTITUTION:In an IC package 1, in which a semiconductor integrated circuit chip 3 is housed and from which lead terminals 2 are led out, the external shape of the package 1 is formed into a hexagon. For example, a flat type IC package 1 having lead terminals 2 of 24 pins is constituted into such a structure that it has a hexagonal form and 4 lead terminals 2 are provided on each of the sides of the hexagonal form. Moreover, an IC chip 3, which has a quadrangular external shape and is provided with connecting pads along the sides of the quadrangular external shape, is provided in the above IC package 1 in such a way that it is connected by 4 to the lead terminals 2 in 6 directions through bonding wires 4 by the shortest distance. Thereby, the hexagonal IC package can be packaged on a printed-wiring board in a high density and the wiring between the IC packages can be made shortest.