MANUFACTURE OF CERAMIC CIRCUIT BOARD

PURPOSE:To improve the adhesive force between a metallic coat and a ceramic substance and, at the same time, to reduce the fluctuation of a ceramic circuit board by using a specific cupric chloride solution as an etching liquid and dipping the metallic coat and ceramic substance in aqueous ammonia and cleaning them by boiling demineralized water before an insulating coat is formed. CONSTITUTION:A metallic coat is formed on the surface of a ceramic substance by an electroless plating method after the surface of the ceramic substance is roughened. Then, after a resist film is formed on the metallic coat and the resist film is exposed to light and developed, etching is performed by using a specific cupric chloride solution of 2.2-2.5 in pH. Then the hardened resist film is removed and the substrate thus formed is dipped in aqueous ammonia and cleaned by boiling demineralized water so as to form a conductor circuit. After the conductor circuit is formed, an insulating film is formed on the upper surface of the circuit. Therefore, a ceramic circuit board which is excellent in adhesive strength and small in fluctuation can be obtained.