MANUFACTURE OF COPPER-PLATED LAMINATED BOARD

PURPOSE:To reduce the error of the position of an inner layer circuit generated when an inner layer circuit board is introduced between prepregs to heat and pressurize it by forming the width of a groove formed on the periphery of the board to a specific size or less and forming the outer periphery of the groove in the same plane state. CONSTITUTION:The width 5 of the groove 2 of the periphery of a circuit pattern 1 is formed to 5mm or less, a laminate formed by superposing a copper foil on the surface of an inner layer circuit board 6 through a prepreg is interposed to be held between stainless steel plates, heated and pressurized. Numeral 4 denotes a guide hole 4 for processing. Since a conventional air vent groove 3 is eliminated and the width of the peripheral groove of an inner layer circuit forming part is narrowed, the flowing resistance of prepreg resin is larger than a conventional one. Accordingly, variation in the inner layer circuit position before and after the layer is formed is reduced, and conventional voids are eliminated.