ADHESIVE COMPOSITION WHICH HARDLY CAUSES PLATE PEELING

PURPOSE:To obtain the title composition which hardly causes plate peeling when destroyed and has improved strength by using a specified modified epoxy resin and glass fibers or carbon fibers as the constituents. CONSTITUTION:50-100 pts.wt. at least one rubber selected from urethane rubber, butyl rub...

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Bibliographische Detailangaben
1. Verfasser:	ITOMI MAKOTO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain the title composition which hardly causes plate peeling when destroyed and has improved strength by using a specified modified epoxy resin and glass fibers or carbon fibers as the constituents. CONSTITUTION:50-100 pts.wt. at least one rubber selected from urethane rubber, butyl rubber, and butadiene rubber is incorporated into 100 pts.wt. epoxy resin to modify the epoxy resin. 100 pts.wt. resin thus obtained is mixed with 5-20 pts.wt. glass fibers and/or carbon fibers having an average fiber length of 0.1-1mm and, if necessary, an inorganic filler, a curing agent, a stabilizing agent, etc.