PASTING AND CLIPPING APPARATUS OF PROTECTIVE TAPE FOR SEMICONDUCTOR WAFER

PURPOSE:To safely use this apparatus by a method wherein, when a cutter unit is raised, a cutting blade piece is hidden automatically and, when the unit is lowered and starts a clipping treatment, the cutting blade piece protrudes properly. CONSTITUTION:When a cutter unit 25 is lowered onto a semiconductor wafer on which a protective tape has been pasted, a tape pressure member 40 is pressed to a protective part protruding to the outside of the semiconductor wafer and the member 40 is retreated and displaced relatively upward by a downward energizing force. Thereby, a cutting blade piece 38 protrudes and acts on the protective tape. Inversely, when the cutter unit 25 is raised and the upper part of a wafer support table 8 is made open, the member 40 detached from the protective tape protrudes by its own energizing force and the cutting blade piece 38 is hidden relatively. Thereby, cutting performance and safety are enhanced.