PLATING MATERIAL EXCELLENT IN MOLD RELEASE PROPERTY

PURPOSE:To obtain plating material which is excellent in mold release properties and also has wear resistance and is utilized for mold material by modifying one part of an organic polymer having a hydrophilic functional group by a hydrophobic functional group and dispersing or codepositing the modified organic polymer into Ni-P alloy plating layer. CONSTITUTION:After Fe-based material utilized as mold material is degreased, a plating layer which contains 0.1-30wt.% P and consists of the balance Ni and inevitable impurities is formed by an electroplating. In this ease, an organic polymer having an acrylic acid-based hydrophilic functional group is incorporated in the plating liquid at >=0.05% expressed in terms of C. Moreover the a polymer of at least 10mol% is modified by a hydrophobic functional group by a proper means. A plating metal component and the polymer are made copresent. Metal and the organic polymer are codeposited on the plating layer by an electrodeposition and codeposition method by utilizing this bath. Thereby the plating material is obtained which is excellent in mold release properties and has wear resistance and is utilized for mold material. This material is preferably utilized as a die for extrusion and a nozzle for injection molding.