SURFACE HARDENING METHOD

PURPOSE:To obtain a hardened surface layer without any clear boundary with a substrate and excellent in adhesion and wear resistance by irradiating the substrate surface with N ion while vapor-depositing a metal on the surface and reducing the concn. of the nitride formed from the surface toward the...

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Bibliographische Detailangaben
1. Verfasser:	OHATA KOKICHI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain a hardened surface layer without any clear boundary with a substrate and excellent in adhesion and wear resistance by irradiating the substrate surface with N ion while vapor-depositing a metal on the surface and reducing the concn. of the nitride formed from the surface toward the inside. CONSTITUTION:An ion source 5 for irradiating a water-cooled rotary substrate holder 3 with N ion 4 from an angle of 45 deg. and a source 7 for Ti vapor 6 are provided in a chamber 2 evacuated by a vacuum pump 1. The surface of a substrate 8 is irradiated with an N ion beam 4 while vapor-depositing Ti on the surface to form a Ti film on the substrate 8 surface. In this case, the TiN concn. is reduced from the substrate 8 surface toward the inside, and the ratio of the characteristic values by X-ray diffraction from the (200) and (111) faces of the TiN (I200/I111) is set to