HEAT-TREATING EQUIPMENT

PURPOSE:To realize treatment excellent in the inside uniformity, transfer a wafer with a robot, and remarkably reduce fraction defective of semiconductor, by performing treatment in the state that a gap is formed between the periphery of a body to be treated and the inside of a straightening plate....

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	USHIGAWA HARUNORI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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