METHOD OF TESTING ELECTRONIC CIRCUIT CONDITION
PURPOSE:To improve a test accuracy by setting the output of an electronic circuit component to be tested to a high impedance condition by a test mode signal in the electronic circuit component connected to the input side of the electronic circuit component to be tested. CONSTITUTION:Probes 60a-63a a...
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| creator | SUGIO AKIMASA MANBA HIROSHI NAKAI JUNJI TAKAHASHI TSUTOMU |
| description | PURPOSE:To improve a test accuracy by setting the output of an electronic circuit component to be tested to a high impedance condition by a test mode signal in the electronic circuit component connected to the input side of the electronic circuit component to be tested. CONSTITUTION:Probes 60a-63a are brought into contact with test pads 60b-63b, respectively. Then, a test mode signal S1 is inputted from a tester 64 to a tri-state buffer 53c via the probe 60a to set the output side lead 53b of an IC chip 53 to a high impedance condition. At the same time, a test drive signal S3 is inputted to the tri-state buffer 56c from the tester 64 to activate the try state buffer 56c. Thus, the effect of the IC chip 53 is removed over a range from a wiring pattern 57 to the IC chip 57. |
| format | Patent |
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CONSTITUTION:Probes 60a-63a are brought into contact with test pads 60b-63b, respectively. Then, a test mode signal S1 is inputted from a tester 64 to a tri-state buffer 53c via the probe 60a to set the output side lead 53b of an IC chip 53 to a high impedance condition. At the same time, a test drive signal S3 is inputted to the tri-state buffer 56c from the tester 64 to activate the try state buffer 56c. 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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS PRINTED CIRCUITS TESTING |
| title | METHOD OF TESTING ELECTRONIC CIRCUIT CONDITION |
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