METHOD OF TESTING ELECTRONIC CIRCUIT CONDITION

PURPOSE:To improve a test accuracy by setting the output of an electronic circuit component to be tested to a high impedance condition by a test mode signal in the electronic circuit component connected to the input side of the electronic circuit component to be tested. CONSTITUTION:Probes 60a-63a a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SUGIO AKIMASA, MANBA HIROSHI, NAKAI JUNJI, TAKAHASHI TSUTOMU
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To improve a test accuracy by setting the output of an electronic circuit component to be tested to a high impedance condition by a test mode signal in the electronic circuit component connected to the input side of the electronic circuit component to be tested. CONSTITUTION:Probes 60a-63a are brought into contact with test pads 60b-63b, respectively. Then, a test mode signal S1 is inputted from a tester 64 to a tri-state buffer 53c via the probe 60a to set the output side lead 53b of an IC chip 53 to a high impedance condition. At the same time, a test drive signal S3 is inputted to the tri-state buffer 56c from the tester 64 to activate the try state buffer 56c. Thus, the effect of the IC chip 53 is removed over a range from a wiring pattern 57 to the IC chip 57.