SEMICONDUCTOR DEVICE

PURPOSE:To obtain a device, a bonding pad of which can be scaled down while the bonding pad can be connected directly to the internal terminal of the lead frame of a film carrier without forming a bump, by making the top face of the bonding pad higher than that of a surface protective film by the pr...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	CHATANI SHIGEO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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